Elektronikos dalys : MR18R326GAG0-CT9

Gamintojas : SAMSUNG[Samsung semiconductor]

Pakuotė :

Pin :

Aprašymas : (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

Temperatūra : Min °C | Maks °C

Datasheet : MR18R326GAG0-CT9 PDF

• MR18R326GAG0
• MR18R326GAG0-CM8
• MR18R326GAG0-CT9